So, I had some issues with installing the GPU in the case, and the GPU bottom (those metals things at the bottom) ended up scratching part of the motherboard. From what I can tell, there’s a bunch of similar components all the way up, so I’d think there’s redundancy, so I guess it’s not that important. Here is a picture:
https://i.postimg.cc/7LBwkr3h/62e626.jpg
https://files.catbox.moe/62e626.jpg
PC boots fine into bios, fans work, stuff are recognized, mouse and keyboard also works, but I haven’t really done much beyond that.
Motherboard is: MSI B650 Gaming Plus Wifi
It’s located here, and on them, it is written K72 then vertically smaller K2 (the 2 has an underline):
https://i.postimg.cc/XJNcnppT/modelblock-gaming-pd.png
https://files.catbox.moe/7otcn6.png
Should I get a new motherboard?
Edit: Better quality image, and new image host added.
From the TI briefing note:
It would also provide redundancy in case of a failure—if you had only one, and it failed (or was scraped off by an over-enthusiastic GPU installation), you would probably not be going to space today.
So I guess, what this means is having one scrapped off or failing isn’t a big issue (because of built-in redundancy accounting exactly for that)?
My gut feeling is they didn’t put 20 there in case you scraped one off. But likely the others will have enough leeway to cover for it. If the power rail gets stressed enough, it might well fail sooner than it would have.
My other running theory is that (due to relative proximity to audio chip), they’re muting FETs for muting audio channels when connecting headphones/speakers to prevent speaker pop.
Interesting. Is the orange line on the board separating the audio section from the rest?
Possibly. Might be marking some isolation or just a stylistic choice by the designer.
Can you link that note?
I think that’s usually the method in high power applications where heat dissipation is paramount. Each of these diodes is only rated for 210mA of drain current. From a BOM cost perspective, it’d be much cheaper to just buy one 5A FET rather than parallelizing a bunch of 0.21A FETs. That 5A FET would be in a package that could handle whatever heat it generates.
You’re probably right—I searched for ‘20 mosfets in parallel’ or something like that and it came up near the top. But I didn’t read the whole thing.
I guess there’s got to be some reason for using so many though?